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ESD11B5.0ST5G Transient Voltage Suppressors
Micro-Packaged Diodes for ESD Protection
The ESD11B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space comes at a premium.
Specification Features http://onsemi.com
* * * * * * * * * *
Low Capacitance 12 pF Low Clamping Voltage Small Body Outline Dimensions: 0.60 mm x 0.30 mm Low Body Height: 0.3 mm Stand-off Voltage: 5.0 V Low Leakage Response Time is < 1 ns IEC61000-4-2 Level 4 ESD Protection IEC61000-4-4 Level 4 EFT Protection These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
MARKING DIAGRAM
PIN 1 DSN2 CASE 152AA XXXX YYY XXXX YYY
= Specific Device Code = Year Code
ORDERING INFORMATION
Device ESD11B5.0ST5G Package DSN2 (Pb-Free) Shipping 5000/Tape & Reel
Mechanical Characteristics MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating IEC 61000-4-2 (ESD) Contact Air PD RqJA TJ, Tstg TL Symbol Value 8.0 15 250 400 -40 to +125 260 Unit kV mW C/W C C
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25C Thermal Resistance, Junction-to-Ambient Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
(c) Semiconductor Components Industries, LLC, 2009
July, 2009 - Rev. 2
1
Publication Order Number: ESD11B5.0S/D
ESD11B5.0ST5G
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current IPP IT VC VBR VRWM IR IR VRWM VBR VC IT IPP I
V
*See Application Note AND8308/D for detailed explanations of datasheet parameters.
Bi-Directional TVS
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
VRWM (V) Device ESD11B5.0ST5G Device Marking 11B5 Max 5.0 IR (mA) @ VRWM Max 1.0 VBR (V) @ IT (Note 2) Min 5.8 IT mA 1.0 C (pF) Typ 12 Max 13.5 VC Per IEC61000-4-2 (Note 4) Figures 1 and 2 See Below
2. VBR is measured with a pulse test current IT at an ambient temperature of 25C. 3. Surge current waveforms per Figure 5. 4. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
Figure 1. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000-4-2
Figure 2. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000-4-2
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ESD11B5.0ST5G
IEC 61000-4-2 Spec.
Test Voltage (kV) 2 4 6 8 First Peak Current (A) 7.5 15 22.5 30 Current at 30 ns (A) 4 8 12 16 Current at 60 ns (A) 2 4 6 8 I @ 60 ns 10% tP = 0.7 ns to 1 ns I @ 30 ns IEC61000-4-2 Waveform Ipeak 100% 90%
Level 1 2 3 4
Figure 3. IEC61000-4-2 Spec
ESD Gun
TVS
Oscilloscope
50 W Cable
50 W
Figure 4. Diagram of ESD Test Setup The following is taken from Application Note AND8308/D - Interpretation of Datasheet Parameters for ESD Devices. ESD Voltage Clamping
For sensitive circuit elements it is important to limit the voltage that an IC will be exposed to during an ESD event to as low a voltage as possible. The ESD clamping voltage is the voltage drop across the ESD protection diode during an ESD event per the IEC61000-4-2 waveform. Since the IEC61000-4-2 was written as a pass/fail spec for larger
100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0 20 tP tr
systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes. For more information on how ON Semiconductor creates these screenshots and how to interpret them please refer to AND8307/D.
PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms
40 t, TIME (ms)
60
80
Figure 5. 8 X 20 ms Pulse Waveform
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ESD11B5.0ST5G
PACKAGE DIMENSIONS
DSN2, 0.6x0.3, 0.4P, (0201) CASE 152AA-01 ISSUE O
D A B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. DIM A A1 b D E e L MILLIMETERS MIN MAX 0.24 0.30 0.00 0.01 0.22 0.28 0.30 BSC 0.60 BSC 0.40 BSC 0.12 0.18
2X
0.06 C
2X
E
0.06 C TOP VIEW 0.05 C A
CATHODE BAND MONTH CODING
DEC C
SEATING PLANE
NOV OCT
2X
0.05 C
A1 SIDE VIEW e
SEP JUN MAR FEB JAN
XXXX YYY XXXX Y09
INDICATES AUG 2009
DEVICE CODE YEAR CODE
1 2X
L
2
2X
b 0.05 C A B
(EXAMPLE)
BOTTOM VIEW
MOUNTING FOOTPRINT*
0.28
0.75
0.28
0.30
DIMENSIONS: MILLIMETERS
See Application Note AND8398/D for more mounting details *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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ESD11B5.0S/D

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